| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E3-1200 v3 |
| Model number ? | E3-1220 v3 |
| CPU part numbers |
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| Frequency ? | 3100 MHz |
| Turbo frequency | 3500 MHz (1 core) 3300 MHz (4 cores) |
| Bus speed ? | 5 GT/s DMI |
| Package | 1150-land Flip-Chip Land Grid Array |
| Socket | Socket 1150 / H3 / LGA1150 |
| Size | 1.48" x 1.48" / 3.75cm x 3.75cm |
| Introduction date | June 2, 2013 (launch) June 4, 2013 (announcement) |
| Price at introduction | $193 (OEM) $203 (box) |
| S-spec numbers | |
| Architecture / Microarchitecture | |
| Microarchitecture | Haswell |
| Platform | Denlow |
| Processor core ? | Haswell LGA1150 |
| Core stepping ? | C0 (QED9, QEJ3, SR154) |
| CPUID | 306C3 (QED9) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 4 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 4 x 32 KB 8-way set associative instruction caches 4 x 32 KB 8-way set associative data caches |
| Level 2 cache size ? | 4 x 256 KB 8-way set associative caches |
| Level 3 cache size | 8 MB 16-way set associative shared cache |
| Physical memory | 32 GB |
| Multiprocessing | Uniprocessor |
| Features |
|
| Low power features |
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| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1333, DDR3-1600 DIMMs per channel: up to 2 Maximum memory bandwidth (GB/s): 25.6 ECC supported: Yes |
| Other peripherals |
|
| Electrical / Thermal parameters | |
| Thermal Design Power ? | 80 Watt |
