| General information | |||||||||
| Type | CPU / Microprocessor | ||||||||
| Market segment | Server | ||||||||
| Family | Intel Xeon E3-1200 v6 | ||||||||
| Model number ? | E3-1245 v6 | ||||||||
| CPU part numbers |
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| Frequency ? | 3700 MHz | ||||||||
| Turbo frequency | 4100 MHz | ||||||||
| Bus speed ? | 8 GT/s DMI | ||||||||
| Clock multiplier ? | 37 | ||||||||
| Package | 1151-land Flip-Chip Land Grid Array | ||||||||
| Socket | Socket 1151 / H4 / LGA1151 | ||||||||
| Size | 1.48" x 1.48" / 3.75cm x 3.75cm | ||||||||
| Introduction date | March 28, 2017 | ||||||||
| Price at introduction | $284 | ||||||||
| S-spec numbers | |||||||||
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| Architecture / Microarchitecture | |||||||||
| Microarchitecture | Kaby Lake | ||||||||
| Processor core ? | Kaby Lake-S | ||||||||
| Core stepping ? | B0 (SR32B) | ||||||||
| Manufacturing process | 0.014 micron | ||||||||
| Data width | 64 bit | ||||||||
| The number of CPU cores | 4 | ||||||||
| The number of threads | 8 | ||||||||
| Floating Point Unit | Integrated | ||||||||
| Level 1 cache size ? | 4 x 32 KB 8-way set associative instruction caches 4 x 32 KB 8-way set associative data caches |
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| Level 2 cache size ? | 4 x 256 KB 4-way set associative caches | ||||||||
| Level 3 cache size | 8 MB 16-way set associative shared cache | ||||||||
| Physical memory | 64 GB | ||||||||
| Multiprocessing | Uniprocessor | ||||||||
| Features |
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| Low power features | Enhanced SpeedStep technology ? | ||||||||
| Integrated peripherals / components | |||||||||
| Display controller | 3 displays | ||||||||
| Integrated graphics | GPU Type: Intel HD P630 Graphics tier: GT2 Microarchitecture: Gen 9 LP Base frequency (MHz): 350 Maximum frequency (MHz): 1150 |
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| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1866, DDR4-2400 Maximum memory bandwidth (GB/s): 37.5 ECC supported: Yes |
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| Other peripherals |
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| Electrical / Thermal parameters | |||||||||
| V core ? | 0.55V - 1.52V | ||||||||
| Thermal Design Power ? | 73 Watt | ||||||||
